IKC Series DIP Switch

The very low profile IKC J-bend half pitch DIP switch is designed for reliable operation with an extremely small PCB space requirement. Process compatible (withstand IR reflow soldering) and washable (tape seal standard).

MAIN FEATURES

  • 1,27 mm (.050) terminal to terminal pitch
  • Overall height from PCB : 1,7 mm (.067)
  • Very small PCB space requirement
  • Process compatible – withstand IR reflow soldering
  • Washable (tape seal standard)

View all DIP switches here.

 

Description

The very low profile APEM IKC J-bend half pitch DIP switch is designed for reliable operation with an extremely small PCB space requirement. Process compatible (withstand IR reflow soldering) and washable (tape seal standard).

MAIN FEATURES

  • 1,27 mm (.050) terminal to terminal pitch
  • Overall height from PCB : 1,7 mm (.067)
  • Very small PCB space requirement
  • Process compatible – withstand IR reflow soldering
  • Washable (tape seal standard)

View all APEM products here.

Follow us on Facebook

• Gold plated contact to ensure low resistance and long mechanical life.

ENVIRONMENTAL SPECIFICATIONS
• Operating temperature: -25°C to +70°C
• Storage temperature: -40°C to +85°C

MATERIALS
• Case: Polyamide
• Base: Polyamide
• Actuator: Polyamide
• Contact spring: Copper beryllium alloy
• Terminal: Gold plated
• Contact: Gold plated

• Max. current/voltage rating: 25mA 24VDC
• Contact rating: 100mA
• Initial contact resistance: 100mΩ max
• Insulation resistance: 500MΩ min. at 100VDC
• Dielectric strength: 300VAC Min. for 60 seconds

• Actuation force: 800gf (7.84N) Max
• Mechanical life: 1,000 cycles